Suitable for dressing and profiling diamond and CBN grinding wheels
using silicon carbide wheels (individually or in a package).,
Accessories:, Total enclosure,, Camera system with 7x motorized zoom
video system, plus 10x digital zoom, image field 25 x 20 mm,
Extraction system 4000/3 D 240 3kW 630 m³/h, Swivel unit for package
dressing, Grinding wheel guard, swivels to the rear, Software for
converting DXF files to CNC files on PC, Touchscreen, Standard
software for straight, bevel or radii., Single Diamond- / CBN grinding
wheel diameter: 400 mm, Single-disc width: 30 mm, Packages: packages
to Ø 150 mm and width 150 mm, Swivel axis: swivel plate for swivel
angle: +/- 95 degrees, Delivery axis travel: 82 mm, Oscillation hub :
83 mm, Spindle mounting diameter: 60 mm, DIA/CBN wheel flange hole: 32
mm, Speed of silicon wafer: 700 - 2800 rpm, SIC Grinding Spindle: 60
mm Ø, Workpiece clamping X-axis travel: 185 mm, Y-axis travel: 194
mm, Workpiece spindle head holder diameter : 100 mm, with belt spindle
diameter : 100 x 200 mm, Grinding wheel balance: max. 40 kg, Workpiece
spindle speed: 500 - 1500 rpm, SIC discs up to max.: 200 x 20 mm x 32
mm, Connected load: approx. 2.5 kW (400 Volts / 50 Hz), Dimensions W x
D x H: 2700 x 2200 x 2200 mm, weight: 1900 kg, colour: red RAL 3003 /
grey RAL 7035