Grinding Discs CLEVELAND G-APU 5

metal working machines / accessories for machine tools / Grinding Discs

Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels (individually or in a package)., Accessories:, Total enclosure,, Camera system with 7x motorized zoom video system, plus 10x digital zoom, image field 25 x 20 mm, Extraction system 4000/3 D 240 3kW 630 ...

Manufacturer: CLEVELAND

Model:G-APU 5

Type of machine: Grinding Discs

item-No.: 169546988

Quantity: 1

Date: 08.06.2026

Year of manufacture: 2017

Location: Land-de Germany cloppenburg

Price:


Seller-item-No.:M02291

Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels (individually or in a package)., Accessories:, Total enclosure,, Camera system with 7x motorized zoom video system, plus 10x digital zoom, image field 25 x 20 mm, Extraction system 4000/3 D 240 3kW 630 m³/h, Swivel unit for package dressing, Grinding wheel guard, swivels to the rear, Software for converting DXF files to CNC files on PC, Touchscreen, Standard software for straight, bevel or radii., Single Diamond- / CBN grinding wheel diameter: 400 mm, Single-disc width: 30 mm, Packages: packages to Ø 150 mm and width 150 mm, Swivel axis: swivel plate for swivel angle: +/- 95 degrees, Delivery axis travel: 82 mm, Oscillation hub : 83 mm, Spindle mounting diameter: 60 mm, DIA/CBN wheel flange hole: 32 mm, Speed of silicon wafer: 700 - 2800 rpm, SIC Grinding Spindle: 60 mm Ø, Workpiece clamping X-axis travel: 185 mm, Y-axis travel: 194 mm, Workpiece spindle head holder diameter : 100 mm, with belt spindle diameter : 100 x 200 mm, Grinding wheel balance: max. 40 kg, Workpiece spindle speed: 500 - 1500 rpm, SIC discs up to max.: 200 x 20 mm x 32 mm, Connected load: approx. 2.5 kW (400 Volts / 50 Hz), Dimensions W x D x H: 2700 x 2200 x 2200 mm, weight: 1900 kg, colour: red RAL 3003 / grey RAL 7035
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Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels (individually or in a package)., Accessories:, Total enclosure,, Camera system with 7x motorized zoom video system, plus 10x digital zoom, image field 25 x 20 mm, Extraction system 4000/3 D 240 3kW 630 m³/h, Swivel unit for package dressing, Grinding wheel guard, swivels to the rear, Software for converting DXF files to CNC files on PC, Touchscreen, Standard software for straight, bevel or radii., Single Diamond- / CBN grinding wheel diameter: 400 mm, Single-disc width: 30 mm, Packages: packages to Ø 150 mm and width 150 mm, Swivel axis: swivel plate for swivel angle: +/- 95 degrees, Delivery axis travel: 82 mm, Oscillation hub : 83 mm, Spindle mounting diameter: 60 mm, DIA/CBN wheel flange hole: 32 mm, Speed of silicon wafer: 700 - 2800 rpm, SIC Grinding Spindle: 60 mm Ø, Workpiece clamping X-axis travel: 185 mm, Y-axis travel: 194 mm, Workpiece spindle head holder diameter : 100 mm, with belt spindle diameter : 100 x 200 mm, Grinding wheel balance: max. 40 kg, Workpiece spindle speed: 500 - 1500 rpm, SIC discs up to max.: 200 x 20 mm x 32 mm, Connected load: approx. 2.5 kW (400 Volts / 50 Hz), Dimensions W x D x H: 2700 x 2200 x 2200 mm, weight: 1900 kg, colour: red RAL 3003 / grey RAL 7035
seller offer No. resale M02291
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SuS Schleiftechnik GmbH

Mr Ralf Grave
49661 Cloppenburg
Germany

RESALE member since 2021

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