5 CLEVELAND used machine for sale

Cleveland TKET-6-T Twin cooking kettle 2009, stainless, steam jacketed twin vessels, 2 x 25L vessels, adjustable temperature controls, 3Ph

Cleveland KGL40 kettle stainless, 40gallon, jacketed cooking kettle, adjustable temperature controls, steam jacketed, 1Ph

Manufacturer: Cleveland Model: GAPU-5 A/M Diamond Discs: - Maximum Diameter: 200 mm - Minimum Diameter: 180 mm - Maximum Width (with double disc): 100 mm Note: The supplied grinding wheel guard is designed for a maximum diameter of 200 mm and a minimum diameter of 180 mm. Workpiece Spindle: - Speed Range: 400 – 4500 rpm Planing Unit: - Swivel Range: 190° - Oscillation Stroke: 70 mm - Oscillation Speed: Infinitely adjustable - Spindle Speed: 1400 or 2800 rpm Planing Grinding Disc: - Diameter: 200 mm - Width: 20 mm - Bore Diameter: 32 mm Machine Dimensions: - Length: 1250 mm - Width: 1000 mm - Height: 1100 mm - Weight: 450 kg Noise Emission: - Standard Operating Sound Level: 83 dB(A) - May be lower in individual cases Find more here - / Contact us at -

Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels (individually or in a package)., Accessories:, Total enclosure,, Camera system, image field 20 x 16 mm, Extraction system 4000/3 D 240 3kW 630 m³/h, Swivel unit for package dressing, Software for converting DXF files to CNC files on PC, Touchscreen, Standard software for straight, bevel or radii etc. DXF files., Single Diamond- / CBN grinding wheel diameter: 400 mm, Single-disc width: 30 mm, Packages: packages to Ø 150 mm and width 150 mm, Swivel axis: swivel plate for swivel angle: +/- 95 degrees, Delivery axis travel: 82 mm, Oscillation hub : 83 mm, Spindle mounting diameter: 60 mm, DIA/CBN wheel flange hole: 32 mm, Speed of silicon wafer: 700 - 2800 rpm, SIC Grinding Spindle: 60 mm Ø, Workpiece clamping X-axis travel: 185 mm, Y-axis travel: 194 mm, Workpiece spindle head holder diameter ...

Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels (individually or in a package)., Accessories:, Total enclosure,, Camera system with 7x motorized zoom video system, plus 10x digital zoom, image field 25 x 20 mm, Extraction system 4000/3 D 240 3kW 630 m³/h, Swivel unit for package dressing, Grinding wheel guard, swivels to the rear, Software for converting DXF files to CNC files on PC, Touchscreen, Standard software for straight, bevel or radii., Single Diamond- / CBN grinding wheel diameter: 400 mm, Single-disc width: 30 mm, Packages: packages to Ø 150 mm and width 150 mm, Swivel axis: swivel plate for swivel angle: +/- 95 degrees, Delivery axis travel: 82 mm, Oscillation hub : 83 mm, Spindle mounting diameter: 60 mm, DIA/CBN wheel flange hole: 32 mm, Speed of silicon wafer: 700 - 2800 rpm, SIC Grinding Spindle: 60 mm Ø, Workpiece clampi ...